Reliability Test of Electronic Components

Note: Joint Electrical and Computer Engineering Department and Physics Department special seminar
Speaker: Thomas Koschmeider, Ph.D., Freescale Semiconductor, Inc.

When: October 29, 2010 (Fri), 03:00PM to 04:00PM (add to my calendar)
Location: PHO 339

Abstract:
An overview of many different types of electronic packages for microprocessors and sensors will be given. Samples of several types of electronic packages will be on hand so that size scale can be better assessed. Next, how one tests the mechanical reliability of electronic packages will be discussed by taking a look at the reliability goals of end customers in different market spaces (e.g. automotive). Several videos of how one looks for possible damage caused by consumers of portable electronics show the importance of design. If time permits some perspectives of working in industry as a scientist and engineer will be given.