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VERSION:2.0
PRODID:-//RLASKEY//CALENDEROUS//EN
CALSCALE:GREGORIAN
METHOD:PUBLISH
BEGIN:VEVENT
DTSTAMP:20260913T094512Z
LAST-MODIFIED:20121116T203436Z
DTSTART:20101029T190000Z
DTEND:20101029T200000Z
UID:event719@bu.edu
URL:http://physics.bu.edu/internal/events/show/719
SUMMARY:Reliability Test of Electronic Components
DESCRIPTION:Featuring Thomas Koschmeider\, Ph.D.\, Freescale Semiconductor\
	, Inc.\n\nAbstract:\nAn overview of many different types of electronic pack
	ages for microprocessors and sensors will be given. Samples of several type
	s of electronic packages will be on hand so that size scale can be better a
	ssessed. Next\, how one tests the mechanical reliability of electronic pack
	ages will be discussed by taking a look at the reliability goals of end cus
	tomers in different market spaces (e.g. automotive). Several videos of how 
	one looks for possible damage caused by consumers of portable electronics s
	how the importance of design. If time permits some perspectives of working 
	in industry as a scientist and engineer will be given.
LOCATION:PHO 339\, 8 Saint Mary's Street\, 02215
STATUS:CONFIRMED
CLASS:PUBLIC
END:VEVENT
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